The W Series Micro XRF from Bowman features a 7.5 µm FWHM X-ray beam, the smallest in the world for coating thickness analysis using XRF technology. This makes it ideal for measuring small components like BGAs and solder bumps. It includes a dual-camera system with 140X magnification for precision imaging and a secondary camera for live viewing. A programmable X-Y stage with ±1 µm accuracy, along with pattern recognition and auto-focus, enables precise measurements and automated multi-point analysis. The system also offers 3D mapping for coating topography visualization. Standard configurations include a molybdenum anode tube (with optional chromium or tungsten) and a high-resolution Silicon Drift Detector. The instrument can measure up to five coating layers simultaneously and operates with Archer software, which streamlines measurement, reporting, and application setup.
The MINERVA centrifugal screener is designed for high-capacity screening, making it ideal for processes that demand both efficiency and accuracy in particle separation. It serves two main purposes: first, to classify particles by size in bulk materials with poor flow properties due to high moisture, greasiness, or electrostatic charge, thereby improving screening efficiency; and second, to perform safety screening of finished products by removing impurities, ensuring the final product’s quality and purity.
Battery Tester
With a foot print as small as 360mm*450mm, Neware mini chamber is perfect for small batch battery tests in the research and development labs.
Leak Tester
The Oxipack Multi Leak Tester (MLT) offers a versatile and efficient solution for testing various rigid products like pods, capsules, cans, jars, bottles, vials, and cups. Embracing a broad spectrum of dimensions and shapes, the MLT employs the vacuum decay method for leak testing, ensuring a comprehensive assessment of the entire packaging. It's tight fit rigid part is pre-formed to precisely fit the packaging, creating a minimal measuring space and a deep vacuum in the test chamber. This feature allows the MLT to adeptly detect both micro-leaks and larger leaks, maintaining the integrity of the packaging and seals. The MLT's ability to adapt to different package sizes and filling weights makes it an invaluable tool for industries requiring high-precision leak testing, delivering direct, accurate, and non-destructive results.
Measuring Machine
Nano 3D Optical Surface Profilometers SuperView W1 – CHOTEST
The SuperView W1 is a high-precision Nano 3D Optical Surface Profilometer developed by Chotest Technology Inc., designed for non-contact measurement and analysis of surface topography and roughness at the sub-nanometer level. Utilizing white light interferometry, it is suitable for applications in semiconductor manufacturing, 3C electronics, ultraprecise machining, optical engineering, micro-nano materials, and MEMS industries
Measuring Machine
Nano 3D Optical Surface Profilometers SuperView W1-Lite – CHOTEST
The SuperView W1-Lite is a compact, high-precision Nano 3D Optical Surface Profilometer developed by Chotest Technology Inc. Designed for non-contact, sub-nanometer surface measurements, it utilizes white light interferometry combined with precision Z-axis scanning and 3D modeling algorithms. This makes it suitable for applications in semiconductor manufacturing, 3C electronics, ultraprecise machining, optical engineering, micro-nano materials, and MEMS industries.
Measuring Machine
Nano 3D Optical Surface Profilometers SuperView W1-Ultra – CHOTEST
The SuperView W1-Ultra is an advanced Nano 3D Optical Surface Profilometer developed by Chotest Technology Inc., designed for high-precision, non-contact surface measurements across various industries. Here's an overview of its key features and specifications.
Measuring Machine
Nano 3D Optical Surface Profilometers SuperView W3 – CHOTEST
The SuperView W3 is a high-precision Nano 3D Optical Surface Profilometer developed by Chotest Technology Inc. It employs white light interferometry combined with a precision Z-axis scanning module and advanced 3D modeling algorithms to perform non-contact surface measurements with sub-nanometer resolution. This instrument is designed for detailed analysis of surface roughness, flatness, waviness, and other topographical features across various industries.